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Product
Introduction
Application:
? Desktop
Features:
? Solder Ball, SMT Soldering
? Land Grid Array at Contract Side
Specification:
Mechanical:
? Pitch: 0.914mm (X) ×0.914mm (Y)
? Durability: 20 Cycles
Electrical:
? Current Rating: Max. 0.3A / Pin
? Contact Resistance: Max. 25mΩ (Initial & Final)
Physical:
? Housing: LCP, Black, UL 94V-0
? Contact: Copper alloy
? ILM Frame: Low carbon steel
? ILM Load Plate: Stainless steel
? ILM Load Lever: Stainless steel
? Screw / Shoulder Screw: Low carbon steel
? Back Plate: Low carbon steel
? Solder Ball: SnAgCu
? PnP Cap: LCP, Black
? Plating: Min. 15u” gold plating on contact area
? Operating Temperature: -25℃~105℃
Packaging:
? Hard Tray
Order Information:
? CPU Socket: ACA-ZIF-068-***(1156Pin)
ACA-ZIF-096-***(1155Pin)
? ILM: ACA-ZIF-078-K**
? Back Plate: DCA-HSK-144-K0**
? ILM + Back Plate: ACA-ZIF-082-K**
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