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Product
Introduction
Application:
? Server
Features:
? Solder Ball, SMT Soldering
? Land Grid Array at Contract Side
Specification:
Mechanical:
? Pitch: 1.016mm (X) ×1.016mm (Y)
? Durability: 30 Cycles
Electrical:
? Current Rating: Max. 0.3A / Pin
? Contact Resistance: Max. 15.2mΩ (Initial & Final)
Physical:
? Housing: LCP, Black, UL 94V-0
? Contact: Copper alloy
? ILM Frame: Stainless steel
? ILM Load Plate: Stainless steel
? ILM Load Lever: Stainless steel
? Fastener Nut: Carbon steel
? Backplate: Carbon steel
? Solder Ball: SnAgCu
? PnP Cap: LCP, Black
? Plating: Min. 15u” gold plating on contact area
? Operating Temperature: -25℃~100℃
Packaging:
? Hard Tray
Order Information:
? CPU Socket: ACA-ZIF-063-***(1366Pin)
ACA-ZIF-124-***(1356Pin)
? ILM: ACA-ZIF-066-K0*
? Back Plate: DCA-HSK-132-K0* (For Server)
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